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product structure silicon monolithic integrated circuit this product has no designed protection against radioactive ra ys . 1/ 17 tsz02201-0j2j0a601070-1-2 ? 20 15 rohm co., ltd. all rights reserved. 02.nov.2015 rev.001 tsz22111 ? 14 ? 001 www.rohm.com 0.65v to 5.5v, 1ch ultra low dropout linear regulator controller bd3504fvm general description bd3504fvm is an ultra- low dropout linear regulator controller for chipset that can achieve ultra-low input to output voltage . by using n-mosfet for external power transistor, the controller can be used at ultra-low i/o voltage difference as low as the voltage generated by on -resistance. by reducing the i/o voltage difference, large output current is achieved and conversion loss can be reduced, thus the controller can be used in replacement of a switching power supply. in addition, downsizing and cost reduction of the set can be achieved as suitable power transistor can be selected depending on the output current. bd3504fvm does not need any choke coil, diode for rectification and power transistor which are all necessary in a switching power supply, thus reduced total cost and compact size can be achieved for the set. using external resistors, output voltage ranging from 0.65v to 2.5v can be selected. it is also possible to meet the power supply sequence of the set since output voltage start-up time can be adjusted by using the nrcs terminal. features ? reduced rush current by nrcs ? built-in driver for external nch transistor ? built-in timer latch short protection circuit ? built-in under voltage lock out circuit ? output voltage variable type ? built-in thermal shutdown circuit key specifications ? drain voltage range: 0.65v to 5.5v ? supply voltage range: 4.5v to 5.5v ? output voltage range: 0.65v to 2.5v ? external fet gate drive current: 3ma(typ) ? standby current: 0a (typ) ? operating temperature range: -10c to +100c package w(typ) x d(typ) x h(max ) applications mobile pc, desktop pc, digital home appliances typical application circuit and block diagram 8 reference block thermal protection vcc vcc uvlo1 vd uvlo latch uvlo2 uvlo1 en tsd scp uvlo1 uvlo2 en nrcs 0. 65 v vfb g vd vs r2 r1 vin vo en enable 0. 65 v nrcs scp scp gnd nrcs nrcs 0. 65 v r1 r2 tsd vref 4 3 1 2 5 6 7 8 msop8 2.90mm x 4.00mm x 0.90mm r 2 r 1 r 2 r 1 in out datashee t datashee t downloaded from: http:///
bd3504fvm 2/ 17 ? 20 15 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 tsz02201-0j2j0a601070-1-2 02.nov.2015 rev.001 pin configuration pin descriptions pin no. pin name pin function 1 nrcs nrcs (non rush current on start up) time setup. timer latch setup for short circuit protection operating time set up pin. 2 gnd ground pin 3 en enable pin 4 vcc power source 5 vfb output voltage feedback 6 vs source voltage pin 7 g mosfet driver output 8 vd drain voltage sense description of operations 1. vcc bd3504fvm has an independent power input pin for the int ernal circuit operation of the ic. this is used to bias the ic internal circuit and external n-channel mosfet. the voltage us ed for vcc terminal is 5.0v and maximum current is 1.7ma. it is recommended to connect a bypass capacitor with a value o f 1f o r more to vcc pin. 2. en with an input of 2.0v or higher, the en terminal turns to high level and out is produced. at 0.8v or lower, it detects low level and out is turned off. simultaneously, the discharge circuit in side the vs terminal is activated and output voltage is reduced (150 ma (min) when v vs =1v and v en =0v). 3. vd the vd terminal is the drain voltage detection terminal of t he external n-channel mosfet. when drain voltage (in) is low, output voltage is turned off to prevent under voltage loc k out . the reset voltage (v duvlo ) of under voltage lock out circuit is determined by the following equation: ? ?? ? ? ?? ? ? ? ? ? ' ' ' 7.0 1 2 1 r r r v v in vduvlo at low-input drain voltage, when uvlo resistors ha ve resistance values same as output voltage resistors (r 1 = r 1 , r 2 = r 2 ), under voltage lock out (uvlo) is reset when drain voltage (in) reaches 70% of the ou tput voltage. uvlo detects only at the startup of the en terminal. 4. vfb the vfb terminal is use to decide the output voltage and is d etermined by the following equation: ? ?? ? ? ?? ? ? ? ? 1 2 1 r r r v v vfb out where: v v fb is controlled to achieve 0.65 v (typ ). 5. nrcs terminal the nrcs terminal is a constant current output terminal, and operate s as ? soft-start ... during start- up ? scp-delay ... after start- up how to set soft-start of nrcs terminal the output voltage startup time (t nrcs ) is determined by the time when the nrcs terminal reach es v v fb (0.65v). during start-up, the nrcs terminal serves as a constant current s ource (i nrcs ) of 20 a (typ) output, and charges externally connected capacitor (c nrcs ). output voltage (v out ) becomes stable when nrcs terminal reaches the internal reference voltage (0.65v). how to set nrcs terminal short protection delay bd3504fvm has short circuit protection (scp) which is activated whe n output voltage becomes v out x 0.35 (typ) or lower. the time when scp is activated until latch takes plac e (t scp ) is determined by the following equation: scp oscp nrcs scp i v c t ? ? ? when scp is activated, the nrcs terminal provides 20 a (typ) const ant current output (l scp ), and charges the externally connected capacitor (c nrcs ). when the nrcs terminal reaches 1.3v (v oscp ), latch operation is carried out and output voltage is turned off. 1 23 4 5 6 7 8 g vd vs vfb nrcs gnd en vcc top view downloaded from: http:///
bd3504fvm 3/ 17 ? 20 15 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 tsz02201-0j2j0a601070-1-2 02.nov.2015 rev.001 description of operations C continued 6. vs vs terminal is a source voltage detection terminal of the e xternal n-channel mosfet. vfb//vs terminal has the internal discharge circuit activated to lower output voltage when en ch anges to low level or various protection circuits (tsd, scp, uvlo) are activated. 7. g g terminal is the gate drive terminal of the external n-channel m osfet. because the output voltage range of g terminal is up to 5v (vcc), it is necessary to use n-channel mosfet whose thre shold is lower than 5v - v out . in addition, by including an rc snubber circuit to the g terminal, phas e margin of loop gain can be increased and ceramic capaci tors can be used for the terminal. absolute maximum ratings (ta=25 c ) parameter symbol rating unit supply voltage v cc 7 (note 1) v drain voltage v vd 7 v enable input voltage v en 7 v power dissipation pd 0.43 (note 2) w operating temperature range topr - 10 to +100 c storage temperature range tstg - 55 to +150 c maximum junction temperature tjmax +150 c (note 1) however, not exceeding pd. (note 2) to use at temperature above ta=25c, derate by 3.5mw/ c caution: operating the ic over the absolute maximum ratings may damage the ic. the damage can either be a short circuit between pins or an open circuit between pins and the internal circuitry. therefore, it is important to con sider circuit protection measures, such as adding a fuse, in case the ic is operated over the absolute maximum ratings. recommended operating conditions parameter symbol rating unit min max supply voltage v cc 4.5 5.5 v drain voltage v vd 0.65 5.5 v enable input voltage v en -0.3 +5.5 v capacitor in nrcs pin c nrcs 0.001 1 f output voltage v out 0.65 2.5 v electrical characteristics (unless otherwise specified, ta=25 c v cc =5v v in =3.3v v en =3v r 1 =r 1 ' =?, r 2 =r 2 '=0) parameter symbol standard value unit conditions min typ max circuit current i cc - 0.85 1.7 ma shut down mode current i st - 0 10 a v en =0v feed back voltage 1 v vfb1 0.643 0.650 0.657 v i out =50ma feed back voltage 2 v vfb2 0.630 0.650 0.670 v v cc =4.5v to 5.5v , ta=- 10 c to + 100 c (note) output voltage v out - 1.20 - v r 1 =r 1 '=3.9k, r 2 =r 2 '=3.3k line regulation reg.l - 0.1 0.5 %/v v cc =4.5v to 5.5v load regulation reg.l - 0.5 10 mv i out =0 a to 3a [enable] high level enable input vo ltage v enhi 2 - v cc v low level enable input voltage v enlow -0.3 - +0.8 v enable pin input current i en - 7 10 a v en =3v (note ) not 100% tested downloaded from: http:///
bd3504fvm 4/ 17 ? 20 15 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 tsz02201-0j2j0a601070-1-2 02.nov.2015 rev.001 electrical characteristics- continued (unless otherwise specified, ta=25 c v cc =5v v in =3.3v v en =3v r 1 =r 1 '=? , r 2 =r 2 '=0) parameter symbol standard value unit conditions min typ max [voltage feed back] vfb input bias current i v fb - 80 - na [source voltage] vs input bias current i sbias - 1.2 2.4 ma vs standby current i sstb 150 - - ma v vs =1v v en =0v [output mosfet driver] mosfet driver source current i gso 2 3 4 ma v v fb =0.6v, v gate =2.5v mosfet driver sink current i gsi 2 3 4 ma v v fb =0.7v, v gate =2.5v [uvlo] vcc uvlo v cc uvlo 4.20 4.35 4.50 v v cc : sweep up vcc uvlo hysterisis v cc hys 100 160 220 mv v cc : sweep down vd uvlo v vduvlo v out x0.6 v out x0.7 v out x0.8 v vd: sweep up [drain voltage sensing] vd input bias current i vd - 0 - na [nrcs/scp] nrcs charge current i nrcs 14 20 26 a v nrcs =0.5v scp charge current i scp ch 14 20 26 a v nrcs =0.5v scp discharge current i scp di 0.3 - - ma v nrcs =0.5v scp threshold voltage v scp 1.2 1.3 1.4 v short detect voltage v oscp v out x0.3 v out x0.35 v out x0.4 v nrcs stand-by voltage v stb - - 50 mv downloaded from: http:///
bd3504fvm 5/ 17 ? 20 15 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 tsz02201-0j2j0a601070-1-2 02.nov.2015 rev.001 figure 4. enable pin input current vs temperature 6 7 8 9 10 11 12 25 50 75 100 125 150 temperature : ta (c) enable pin input current : i en (a) typical performance curves figure 2. circuit current vs supply voltage figure 1. st andby current vs temperatur e 0.00 0.20 0.40 0.60 0.80 1.00 1.20 1.40 -60 -10 40 90 140 ta( ) temperature : ta (c) standby current : i stb (a) 0.00 0.20 0.40 0.60 0.80 4.5 4.7 4.9 5.1 5.3 5.5 vcc(v) supply voltage : v cc (v) circuit current : i cc (ma) figure 3. output voltage vs temperature 1.770 1.775 1.780 1.785 1.790 1.795 1.800 -10 15 40 65 90 temperature : ta (c) output voltage : v out (v) downloaded from: http:///
bd3504fvm 6/ 17 ? 20 15 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 tsz02201-0j2j0a601070-1-2 02.nov.2015 rev.001 typical performance curves C continued 18.5 19 19.5 20 20.5 21 21.5 -60 40 140 ta( ) iscp(ua) figure 6. i s cp vs temperature i scp (a) temperature : ta (c) figure 5. vs discharge current vs output voltage figure 7. v bg vs temperature 1.23 1.235 1.24 1.245 1.25 1.255 1.26 -60 -10 40 90 140 ta( ) vbg(v) temperature : ta (c) v bg (v) i s (ma) output voltage : v out (mv) 0 50 100 150 200 250 300 0 0.2 0.4 0.6 0.8 1 1.2 downloaded from: http:///
bd3504fvm 7/ 17 ? 20 15 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 tsz02201-0j2j0a601070-1-2 02.nov.2015 rev.001 typical waveforms figure 8. input sequence 1 (en) figure 9. input sequence 2 ( in ) figure 10. input sequence 3 (v cc) v cc v in v en v out (1.075v output) v cc v in v en v out (1.075v output) v cc v in v en v out (1.075v output) figure 11. input sequence 4 v in v en v out downloaded from: http:///
bd3504fvm 8/ 17 ? 20 15 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 tsz02201-0j2j0a601070-1-2 02.nov.2015 rev.001 typical wa veforms C continued figure12. transient response (0a to 3a (0.6a/ s) v=30mv) figure 13. transient response (3a to 0a (0.6a/s) v=20mv) v out i out (1.075v output) (1a/div) v out i out (1.075v output) (1a/div) downloaded from: http:///
bd3504fvm 9/ 17 ? 20 15 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 tsz02201-0j2j0a601070-1-2 02.nov.2015 rev.001 application information 1. application circuit vin r1 r2 c3 ven c4 c1 vcc + 1 2 3 4 8 7 6 5 c2 r1 r2 2. directions for pattern layout of pcb (1) because in input capacitor causes impedance to drop, mo unt it as close as possible to the in terminal using thick wiring patterns. when it causes the wire to come in cont act with the inner-layer ground plane, multiple through hole s connection. (2) because nrcs terminal is analog i/o, be careful of noise. in particular, high-frequency noise of gnd may cause ic malfunction through capacitors. it is recommended to conne ct the gnd terminal of nrcs capacitor to the ic gnd terminal at a single point. (3) the vfb terminal is an output voltage sense line. effe cts of wiring impedance can be ignored by sensing the o utput voltage from the load side, but increased sense wiring ca uses vfb to be susceptible to noise, in which care must be taken. (4) because the gnd terminal is the same gnd to be used in side the analog circuit of bd3504fvm, connect it to the inner -layer gnd of substrate at a single point using a pa ttern that is as short as possible. place a bypass capacito r across vcc and gnd as close as possible so that a loop can be mini mized. (5) the g terminal is the terminal for gate drive. if long wiring wi ll be used, increase the pattern width to lower impedance. (6) heat generated in the output transistor can be calculated by: ? ? ? ? max i v v out out in ? ? design heat generation not to exceed the guaranteed temperature of tra nsistors. (7) connect the output capacitor using thick short wirings so t hat the impedance is minimized . connect capacitor gnd terminal to the inner-layer gnd plane by multiple through holes connectio n. v en c 3 c 2 r 1 r 2 r 2 r 1 r 1 r 1 c 4 r 1 c 1 r 1 v cc r 1 r 1 r 1 v in r 1 downloaded from: http:///
bd3504fvm 10 / 17 ? 20 15 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 tsz02201-0j2j0a601070-1-2 02.nov.2015 rev.001 silk screen top layer bottom layer 3. evaluation board bd3504fvm evaluation board circuit bd3504fvm evaluation board application components bd3504fvm evaluation board layout part no value company parts name u1 - rohm bd3504fvm u2 nmos rohm rtw060n03 r 1 3.9k rohm mcr03ezpf3901 r 1 3.3k rohm mcr03ezpf3301 r 2 3.9k rohm mcr03ezpf3901 part no value company parts name r 2 3.3k rohm mcr03ezpf3301 c 1 1f murata grm18 series c 2 0.01f murata grm18 series c 3 10f murata grm21 series c 4 220f sanyo,etc 2r5tpe220mf bd3504fvm g en vcc nrcs vd vs gnd vcc s1 3 6 5 7 u1 vfb gnd vtts 1 c1 4 2 vcc 8 vin vout c2 c3 c4 u2 r2 r1 r2 r1 r 1 r 2 c 4 c 3 vout r 1 v cc s 1 c 2 c 1 r 2 v in downloaded from: http:///
bd3504fvm 11 / 17 ? 20 15 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 tsz02201-0j2j0a601070-1-2 02.nov.2015 rev.001 power dissipation i/o equivalent circuits ic only j- a= 286 c /w nrcs v cc v cc vd en gate v cc v cc vfb v cc vs v cc downloaded from: http:///
bd3504fvm 12 / 17 ? 20 15 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 tsz02201-0j2j0a601070-1-2 02.nov.2015 rev.001 operational notes 1. reverse connection of power supply connecting the power supply in reverse polarity can damage the ic. take precautions against reverse polarity when connecting the power supply, such as mounting an externa l diode between the power supply and the ics power supply pins. 2. power supply lines design the pcb layout pattern to provide low impedance supp ly lines. separate the ground and supply lines of the digital and analog blocks to prevent noise in the grou nd and supply lines of the digital block from affecting the analog block. furthermore, connect a capacitor to ground at all powe r supply pins. consider the effect of temperature and aging on the capacitance value when using electrolytic capac itors. 3. ground voltage ensure that no pins are at a voltage below that of the ground pin a t any time, even during transient condition. 4. ground wiring pattern when using both small-signal and large-current ground traces, the two ground traces should be routed separately but connected to a single ground at the reference point of th e application board to avoid fluctuations in the small-s ignal ground caused by large currents. also ensure that the ground traces of external components do not cause variations on the ground voltage. the ground lines must be as short and th ick as possible to reduce line impedance. 5. thermal consideration should by any chance the power dissipation rating be exc eeded the rise in temperature of the chip may result in deterioration of the properties of the chip. in case of exceeding this ab solute maximum rating, increase the board size and copper area to prevent exceeding the pd rating. 6. recommended operating conditions these conditions represent a range within which the expec ted characteristics of the ic can be approximately obtained. the electrical characteristics are guaranteed under the conditi ons of each parameter. 7. in rush current when power is first supplied to the ic, it is possible that the internal logic may be unstable and inrush current ma y flow instantaneously due to the internal powering sequence a nd delays, especially if the ic has more than one power supply. therefore, give special consideration to power coupl ing capacitance, power wiring, width of ground wiring, and routing of connections. 8. operation under strong electromagnetic field operating the ic in the presence of a strong electromagnetic field m ay cause the ic to malfunction. 9. testing on application boards when testing the ic on an application board, connecting a capacitor directly to a low-impedance output pin may subject the ic to stress. always discharge capacitors compl etely after each process or ste p. the ics power supply should always be turned off completely before connecting or removing it from the test setup during the inspection process. to prevent damage from static discharge, ground the ic during assembly and use similar precautions during tr ansport and storage. 10. inter-pin short and mounting errors ensure that the direction and position are correct when moun ting the ic on the pcb. incorrect mounting may result in damaging the ic. avoid nearby pins being shorted to each other especially to ground, power supply and output pin. inter-pin shorts could be due to many reasons such as m etal particles, water droplets (in very humid environment) and unintentional solder bridge deposited in between pins during assembly to name a few. 11. unused input pins input pins of an ic are often connected to the gate of a mos transistor. the gate has extremely high impedance and extremely low capacitance. if left unconnected, the electric field from the outside can easily charge it. the small c harge acquired in this way is enough to produce a significant e ffect on the conduction through the transistor and cause unexpected operation of the ic. so unless otherwise specifie d, unused input pins should be connected to the power supply or ground line. downloaded from: http:///
bd3504fvm 13 / 17 ? 20 15 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 tsz02201-0j2j0a601070-1-2 02.nov.2015 rev.001 operational notes C co ntinued 12. regarding the input pin of the ic this monolithic ic contains p+ isolation and p substrate l ayers between adjacent elements in order to keep them isolated. p-n junctions are formed at the intersection of t he p layers with the n layers of other elements, creating a parasitic diode or transistor. for example (refer to figure below): when gnd > pin a and gnd > pin b, the p-n junction operates as a paras itic diode. when gnd > pin b, the p-n junction operates as a parasitic transistor. parasitic diodes inevitably occur in the structure of the ic. the operation of parasitic diodes can result in mutual interference among circuits, operational faults, or physica l damage. therefore, conditions that cause these diodes to operate, such as applying a voltage lower than the gnd v oltage to an input pin (and thus to the p substrate) shoul d be avoided. figure 14. example of monolithic ic structure 13. thermal shutdown circuit(tsd) this ic has a built-in thermal shutdown circuit that preven ts heat damage to the ic. normal operation should always be within the ics power dissipation rating. if however the ratin g is exceeded for a continued period, the junction temperature (tj) will rise which will activate the tsd circuit th at will turn off all output pins. the ic should be powered down and turned on again to resume normal operation becau se the tsd circuit keeps the outputs at the off state even if the tj falls below the tsd threshold. note that the tsd circuit operates in a situation that exceeds the absolute maximum ratings and therefore, under no circumstances, should the tsd circuit be used in a set desi gn or for any purpose other than protecting the ic from heat damage. 14. capacitor between output and ground if a large capacitor is connected between the output pin and gro und pin, current from the charged capacitor can flow into the output pin and may destroy the ic when the vcc or in pin is shorted t o ground or pulled down to 0v. use a capacitor smaller than 10 00 f between output and ground. 15. output capacitor (c 4 ) connect the output capacitor between vs terminals and gnd termi nal properly in order to stabilize output voltage. the output capacitor is use to compensate for the phase of l oop gain and to reduce output voltage fluctuation when there is an abrupt change in load . when there is insufficient capacitance value, there is a possibility for oscillation to occur, and when the equivalent serial resistance (esr) of the capacitor is large, output voltage fluctuation is increased when there is an abrupt change in load. about 220 f high-p erformance electrolytic capacitors are recommended, but this greatly depends on the gate capacity of external mosfet and transconductance (gm), temperature and load conditions. in addition, when only ceramic capacitors w ith low esr are used, or various capacitors are connected in series, the total phase margin of loop gain becomes in sufficient, and oscillation may occur . output capacitance values should be determined only through sufficient testin g of the actual application. tsd on temperature [c] (typ) bd3504fvm 175 n n p + p n n p + p substrate gnd n p + n n p + n p p substrate gnd gnd parasitic elements pin a pin a pin b pin b b c e parasitic elements gnd parasitic elements c be transistor (npn) resistor n region close-by parasitic elements downloaded from: http:///
bd3504fvm 14 / 17 ? 20 15 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 tsz02201-0j2j0a601070-1-2 02.nov.2015 rev.001 operational notes C continued 16. input capacitor setting method (c 1 , c 2 ) the input capacitor is use to lower output impedance of the power supply connected to input terminals (v cc , in). when output impedance of this power supply increases, the inp ut voltages (vcc, in) become unstable and there is a possibility to have oscillation and degraded ripple r ejection characteristics. it is recommended to use capacito rs of about 10 f with low esr, which can provide less ch ange in capacitance due to temperature change, but since inpu t capacitor greatly depends on the characteristics of the powe r supply used for input, substrate wiring pattern, mosfet gate-drain capacity, thorough confirmation under the applica tion temperature, load range, and m-mosfet conditions is required. 17. nrcs terminal capacitor setting method (c 3 ) this ic has a non rush current on start- up (nrcs) function to prevent rush current from in to load and output capacitor via out at the output voltage start- up. when the en terminal is reset from hi or uvlo, constant current is allowed to flow from the nrcs terminal. with this current, volta ge generated at the nrcs terminal becomes the reference voltage and output voltage is started. in order to stab ilize the nrcs set time, it is recommended to use a capacitor (b special) with less change in capacitance due to temperature change. 18. input terminals (vcc, vd , en) this ic has independent construction of en , vd and vcc terminals . in addition, in order to prevent malfunction during low input, the uvlo function is connected to vd and vcc terminals. they begin to start output voltage whe n all the terminals reach the threshold voltage regardless of the input sequence of input terminals. 19. maximum output current (maximum load) the maximum output current capacity of the power supply whic h is used in th is ic depends on the external fet. consequently, confirm the power requirement of the external fet to be used. 20. output protection diode when a load containing a large inductance component is connected to the output terminal, and generation of back-emf at the start-up and when output is turned off is assumed, it is requested to insert a protection diode. output pin (example) downloaded from: http:///
bd3504fvm 15 / 17 ? 20 15 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 tsz02201-0j2j0a601070-1-2 02.nov.2015 rev.001 ordering information b d 3 5 0 4 f v m - t r part number package fvm : msop8 packaging and forming specification tr : emboss tape reel opposite draw-out side: 1 pin marking diagram msop8(top view) d 3 5 part number marking lot number 1pin mark 0 4 downloaded from: http:///
bd3504fvm 16 / 17 ? 20 15 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 tsz02201-0j2j0a601070-1-2 02.nov.2015 rev.001 physical dimension, tape and reel information package name msop8 downloaded from: http:///
bd3504fvm 17 / 17 ? 20 15 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 tsz02201-0j2j0a601070-1-2 02.nov.2015 rev.001 revision history date revision changes 02. nov.2015 001 new release downloaded from: http:///
datasheet d a t a s h e e t notice-pga-e rev.00 2 ? 2015 rohm co., ltd. all rights reserved. notice precaution on using rohm products 1. our products are designed and manufac tured for application in ordinary elec tronic equipments (such as av equipment, oa equipment, telecommunication equipment, home electroni c appliances, amusement equipment, etc.). if you intend to use our products in devices requiring ex tremely high reliability (such as medical equipment (note 1) , transport equipment, traffic equipment, aircraft/spacecra ft, nuclear power controllers, fuel c ontrollers, car equipment including car accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or serious damage to property (?specific applications?), please consult with the rohm sale s representative in advance. unless otherwise agreed in writing by rohm in advance, rohm shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any ro hm?s products for specific applications. (note1) medical equipment classification of the specific applications japan usa eu china class class class b class class ? class 2. rohm designs and manufactures its products subject to strict quality control system. however, semiconductor products can fail or malfunction at a certain rate. please be sure to implement, at your own responsibilities, adequate safety measures including but not limited to fail-safe desi gn against the physical injury, damage to any property, which a failure or malfunction of our products may cause. the following are examples of safety measures: [a] installation of protection circuits or other protective devices to improve system safety [b] installation of redundant circuits to reduce the impact of single or multiple circuit failure 3. our products are designed and manufactured for use under standard conditions and not under any special or extraordinary environments or conditio ns, as exemplified below. accordin gly, rohm shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of an y rohm?s products under any special or extraordinary environments or conditions. if you intend to use our products under any special or extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of product performance, reliability, etc, prior to use, must be necessary: [a] use of our products in any types of liquid, incl uding water, oils, chemicals, and organic solvents [b] use of our products outdoors or in places where the products are exposed to direct sunlight or dust [c] use of our products in places where the products ar e exposed to sea wind or corrosive gases, including cl 2 , h 2 s, nh 3 , so 2 , and no 2 [d] use of our products in places where the products are exposed to static electricity or electromagnetic waves [e] use of our products in proximity to heat-producing components, plastic cords, or other flammable items [f] sealing or coating our products with resin or other coating materials [g] use of our products without cleaning residue of flux (ev en if you use no-clean type fluxes, cleaning residue of flux is recommended); or washing our products by using water or water-soluble cleaning agents for cleaning residue after soldering [h] use of the products in places subject to dew condensation 4. the products are not subjec t to radiation-proof design. 5. please verify and confirm characteristics of the final or mounted products in using the products. 6. in particular, if a transient load (a large amount of load applied in a short per iod of time, such as pulse. is applied, confirmation of performance characteristics after on-boar d mounting is strongly recomm ended. avoid applying power exceeding normal rated power; exceeding the power rating under steady-state loading c ondition may negatively affect product performance and reliability. 7. de-rate power dissipation depending on ambient temperature. when used in sealed area, c onfirm that it is the use in the range that does not exceed t he maximum junction temperature. 8. confirm that operation temperat ure is within the specified range described in the product specification. 9. rohm shall not be in any way responsible or liable for fa ilure induced under deviant condi tion from what is defined in this document. precaution for mounting / circuit board design 1. when a highly active halogenous (chlori ne, bromine, etc.) flux is used, the resi due of flux may negatively affect product performance and reliability. 2. in principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must be used on a through hole mount products. if the flow sol dering method is preferred on a surface-mount products, please consult with the rohm representative in advance. for details, please refer to rohm mounting specification downloaded from: http:///
datasheet d a t a s h e e t notice-pga-e rev.00 2 ? 2015 rohm co., ltd. all rights reserved. precautions regarding application examples and external circuits 1. if change is made to the constant of an external circuit, pl ease allow a sufficient margin considering variations of the characteristics of the products and external components, including transient characteri stics, as well as static characteristics. 2. you agree that application notes, re ference designs, and associated data and in formation contained in this document are presented only as guidance for products use. theref ore, in case you use such information, you are solely responsible for it and you must exercise your own indepen dent verification and judgment in the use of such information contained in this document. rohm shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such information. precaution for electrostatic this product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. please take proper caution in your manufacturing process and storage so that voltage exceeding t he products maximum rating will not be applied to products. please take special care under dry condit ion (e.g. grounding of human body / equipment / solder iron, isolation from charged objects, se tting of ionizer, friction prevention and temperature / humidity control). precaution for storage / transportation 1. product performance and soldered connections may deteriora te if the products are stor ed in the places where: [a] the products are exposed to sea winds or corros ive gases, including cl2, h2s, nh3, so2, and no2 [b] the temperature or humidity exceeds those recommended by rohm [c] the products are exposed to di rect sunshine or condensation [d] the products are exposed to high electrostatic 2. even under rohm recommended storage c ondition, solderability of products out of recommended storage time period may be degraded. it is strongly recommended to confirm sol derability before using products of which storage time is exceeding the recommended storage time period. 3. store / transport cartons in the co rrect direction, which is indicated on a carton with a symbol. otherwise bent leads may occur due to excessive stress applied when dropping of a carton. 4. use products within the specified time after opening a humidity barrier bag. baking is required before using products of which storage time is exceeding the recommended storage time period. precaution for product label qr code printed on rohm products label is for rohm?s internal use only. precaution for disposition when disposing products please dispose them proper ly using an authorized industry waste company. precaution for foreign exchange and foreign trade act since concerned goods might be fallen under listed items of export control prescribed by foreign exchange and foreign trade act, please consult with rohm in case of export. precaution regarding intellectual property rights 1. all information and data including but not limited to application example contained in this document is for reference only. rohm does not warrant that foregoi ng information or data will not infringe any intellectual property rights or any other rights of any third party regarding such information or data. 2. rohm shall not have any obligations where the claims, actions or demands arising from the co mbination of the products with other articles such as components, circuits, systems or external equipment (including software). 3. no license, expressly or implied, is granted hereby under any intellectual property rights or other rights of rohm or any third parties with respect to the products or the informati on contained in this document. pr ovided, however, that rohm will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to manufacture or sell products containing the produc ts, subject to the terms and conditions herein. other precaution 1. this document may not be reprinted or reproduced, in whol e or in part, without prior written consent of rohm. 2. the products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written consent of rohm. 3. in no event shall you use in any wa y whatsoever the products and the related technical information contained in the products or this document for any military purposes, incl uding but not limited to, the development of mass-destruction weapons. 4. the proper names of companies or products described in this document are trademarks or registered trademarks of rohm, its affiliated companies or third parties. downloaded from: http:///
datasheet datasheet notice ? we rev.001 ? 201 5 rohm co., ltd. all rights reserved. general precaution 1. before you use our pro ducts, you are requested to care fully read this document and fully understand its contents. rohm shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny rohms products against warning, caution or note contained in this document. 2. all information contained in this docume nt is current as of the issuing date and subj ec t to change without any prior notice. before purchasing or using rohms products, please confirm the la test information with a rohm sale s representative. 3. the information contained in this doc ument is provi ded on an as is basis and rohm does not warrant that all information contained in this document is accurate an d/or error-free. rohm shall not be in an y way responsible or liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or concerning such information. downloaded from: http:///

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